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Analysis of an Electrostatic Micro-Actuator Based on Vertically-Horizontally Bending

机译:基于垂直-水平弯曲的静电微驱动器分析

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摘要

For the problems of the oversized voltage and undersized displacement in the electrostatic micro actuator of transverse loading recently,a silicon micro actuator model with characteristics of large-displacement and low-voltage is presented based on the principle of vertically-horizontally bending.The deflection equation of the micro actuator is derived.The axial static electricity,temperature stress and axial squeezing pressure on the deformation of micro-beam are analyzed.The simulation shows that the displacement is as big as 17.5μm when the driving voltage is as low as 5V.The displacement is much larger than the deformation of the current micro actuator.
机译:针对近期横向加载静电微执行器中电压过大,位移过小的问题,基于垂直水平弯曲的原理,提出了一种具有大位移,低电压特性的硅微执行器模型。分析了轴向静电,温度应力和轴向挤压压力对微梁变形的影响。仿真表明,驱动电压低至5V时,位移最大为17.5μm。该位移远大于当前微型致动器的变形。

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