首页> 外文会议>American Society of Mechanical Engineers(ASME)/Pacific RIM Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 pt.B; 20050717-22; San Francisco,CA(US) >3D-SOP MILLIMETER-WAVE FUNCTIONS FOR HIGH DATA RATE WIRELESS SYSTEMS USING LTCC AND LCP TECHNOLOGIES3D-SOP MILLIMETER-WAVE FUNCTIONS FOR HIGH DATA RATE WIRELESS SYSTEMS USING LTCC AND LCP TECHNOLOGIES
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3D-SOP MILLIMETER-WAVE FUNCTIONS FOR HIGH DATA RATE WIRELESS SYSTEMS USING LTCC AND LCP TECHNOLOGIES3D-SOP MILLIMETER-WAVE FUNCTIONS FOR HIGH DATA RATE WIRELESS SYSTEMS USING LTCC AND LCP TECHNOLOGIES

机译:使用LTCC和LCP技术的高数据速率无线系统的3D-SOP毫米波功能使用LTCC和LCP技术的高数据速率无线系统的3D-SOP毫米波功能

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摘要

In this paper, the development of three-dimensional (3-D) millimeter-wave functions in multilayer low temperature cofired ceramic (LTCC) and liquid crystal polymer (LCP) technologies is presented for millimeter-wave compact and easy-to-design passive solutions for high data rate wireless systems. Both ceramic and organic technologies are candidates for the 3-D integration of system-on-package (SOP) miniaturized RF/microwave/millimeter-wave systems. LTCC has been widely used as a packaging material because of its process maturity/stability and its relatively high dielectric constant that enables a significant reduction in the module/function dimensions. As an alternative, LCP is an organic material that offers a unique combination of electrical, chemical, and mechanical properties, enabling high-frequency designs due to its ability to act as both the substrate and the package for flexible and conformal multilayer functions. A LTCC patch resonator filter that uses vertical coupling overlap and transverse cuts as design parameters has been designed to achieve a high level of miniaturization and a great compromise between compactness and power handling. Excellent agreement between the simulation and the measurement has been verified for two operating frequency bands (58-60GHz/38-40GHz) of RF communications and sensors for applications such as wireless broadband internet or inter-satellite communications. A band pass filter has been fabricated on LCP substrate, offering a very simple, low loss flexible and low lost filtering solution for wideband millimeter waves applications such as 60 GHz WLAN short-range gigabit wireless systems. The design exploits the ripple near the cut off frequency of Tchebysheff low pass filter to create a band pass response and it exhibits the insertion loss as low as 1.5 dB at the center frequency of 60GHz and 3-dB bandwidth of 16.7 % (~10 GHz).
机译:本文介绍了多层低温共烧陶瓷(LTCC)和液晶聚合物(LCP)技术中的三维(3-D)毫米波函数的开发,以实现毫米波紧凑且易于设计的无源高数据速率无线系统的解决方案。陶瓷技术和有机技术都可以用于系统级封装(SOP)小型化RF /微波/毫米波系统的3D集成。由于LTCC的工艺成熟度/稳定性和相对较高的介电常数(可显着减小模块/功能尺寸),因此LTCC已被广泛用作包装材料。作为替代方案,LCP是一种有机材料,可提供电气,化学和机械特性的独特组合,由于其既可以充当基板又可以充当柔性和共形多层功能的封装,因此可以进行高频设计。已经设计了一种使用垂直耦合重叠和横向切口作为设计参数的LTCC贴片谐振器滤波器,以实现高水平的小型化并在紧凑性和功率处理之间取得很大的折衷。已经针对用于无线宽带互联网或卫星间通信等应用的RF通信和传感器的两个工作频带(58-60GHz / 38-40GHz)验证了仿真与测量之间的出色一致性。带通滤波器已在LCP基板上制造,可为宽带毫米波应用(例如60 GHz WLAN短程千兆位无线系统)提供非常简单,低损耗的灵活且低损耗的滤波解决方案。该设计利用了Tchebysheff低通滤波器截止频率附近的纹波来产生带通响应,并且在60GHz的中心频率和3dB的带宽为16.7%(〜10 GHz)时,插入损耗低至1.5 dB。 )。

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