KLA-Tencor Corporation, 1 Technology Drive, Milpitas CA 95035, USA;
KLA-Tencor Corporation, 1 Technology Drive, Milpitas CA 95035, USA;
KLA-Tencor Corporation, 1 Technology Drive, Milpitas CA 95035, USA;
KLA-Tencor Corporation, 1 Technology Drive, Milpitas CA 95035, USA;
KLA-Tencor Corporation, 1 Technology Drive, Milpitas CA 95035, USA;
KLA-Tencor Corporation, 1 Technology Drive, Milpitas CA 95035, USA;
Institute for Molecular Engineering, University of Chicago, 5747 South Ellis Avenue, Jones 222 Chicago, IL 60637, USA,Imec, Kapeldreef 75, B-3001 Leuven, Belgium;
Imec, Kapeldreef 75, B-3001 Leuven, Belgium;
Institute for Molecular Engineering, University of Chicago, 5747 South Ellis Avenue, Jones 222 Chicago, IL 60637, USA;
Directed self-assembly; DSA defects; Defect simulation; Inspection signal simulation;
机译:检查定向的自组装缺陷
机译:嵌段共聚物自组装的缺陷及其与定向自组装的相关性
机译:化学外延嵌段共聚物定向自组装中缺陷的自由能:图案密度和缺陷位置的影响
机译:通过计算材料设计和优化来理解和缓解嵌段共聚物定向自组装中的桥缺陷
机译:使用特征乘法的嵌段共聚物定向自组装缺陷的根源
机译:定向自组装缺陷an灭的分子途径
机译:与胶体金属纳米粒子表面上的亚纳米级有序配体域引起的缺陷形成选择性定向相互作用,用于定向自组装