Fundamental parameter extraction for a dry/immersion hybrid photoresist for contact hole applications

摘要

EPIC™ 2330 photoresist is an imaging material designed for conventional dry and immersion ArF exposure, its formulation is optimized for contact hole features. Although it performs well in both imaging modes, with good profile, it is not known whether the presence of water impacts the materials fundamental imaging characteristics. Acid generation efficiency, characteristic acid diffusion length and dissolution rates are determined for EPIC 2330 under dry and immersion imaging conditions. The results show, that within measurement errors, no difference is observed for these fundamental parameters whether water is present during exposure, or not.