Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology, Dalian 116024, China;
Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology, Dalian 116024, China;
Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology, Dalian 116024, China;
Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology, Dalian 116024, China;
conditioner; polishing pad; rotation direction; rotation speed and speed ratio; non-uniformity;
机译:化学机械平面化中调节参数对抛光垫表面不均匀性的影响
机译:化学机械平面化过程中调节剂负载对抛光垫表面的影响
机译:化学机械平坦化(CMP)中的金刚石盘垫修整:一种预测垫板表面形状的表面元素方法
机译:调节参数对化学机械平面化抛光垫表面不均匀性的影响
机译:聚氨酯化学机械平面化抛光垫的评估和表征。
机译:调节剂类型和下压力以及垫表面的微观结构对SiO2化学机械平面化性能的影响
机译:通过面朝上抛光控制化学机械平面化中的晶片级非均匀性