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E-beam inspection for detection of sub-design rule physical defects

机译:电子束检查,用于检测子设计规则的物理缺陷

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E-beam inspection provides a complementary approach to brightfield inspection for detection of otherwise difficult to detect physical defects. Advantages of E-beam inspection include superior resolution, the ability to classify defects using patch images and automatic filtering of prior level defects. A key limitation, however, is throughput. Therefore brightfield inspection should always be used for defection of physical defects when effective. For challenging defects, E-beam inspection data may be used as a gold standard for development of the best optical inspection conditions. For very challenging defects, it may be necessary to rely on E-beam inspection. An efficient inspection should be developed. Three examples are presented of challenging defects to illustrate the usefulness of E-beam inspection for physical defect detection.
机译:电子束检查为明场检查提供了一种补充方法,用于检测否则很难检测到的物理缺陷。电子束检查的优点包括出色的分辨率,使用补丁图像对缺陷进行分类的能力以及对先前级别缺陷的自动过滤。但是,关键限制是吞吐量。因此,有效时应始终使用明场检查来纠正物理缺陷。对于具有挑战性的缺陷,可以将电子束检查数据用作制定最佳光学检查条件的金标准。对于非常具有挑战性的缺陷,可能有必要依靠电子束检查。应该建立有效的检查。给出了三个具有挑战性的缺陷的示例,以说明电子束检查对物理缺陷检测的有用性。

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