首页> 外文会议>Advanced Semiconductor Manufacturing Conference, 2007 IEEE/SEMI >A 300mm Semiconductor Manufacturing Foreign Material Reduction Initiative
【24h】

A 300mm Semiconductor Manufacturing Foreign Material Reduction Initiative

机译:300mm半导体制造减少异物倡议

获取原文

摘要

It is well established that foreign material (FM) in a semiconductor manufacturing process can result in significant unplanned tool down time, reduced product yields, and potential reliability performance issues. This paper will present an overview of the
机译:公认的是,半导体制造过程中的异物(FM)可能会导致计划外的大量工具停机时间,降低的产品良率以及潜在的可靠性性能问题。本文将概述

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号