首页> 外文会议>7th ACM computing frontiers conference 2010 >Multiple Sleep Modes Leakage Control in Peripheral Circuits of a All Major SRAM-Based Processor Units
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Multiple Sleep Modes Leakage Control in Peripheral Circuits of a All Major SRAM-Based Processor Units

机译:所有主要基于SRAM的处理器单元外围电路中的多种休眠模式泄漏控制

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Leakage currents in on-chip SRAMs: caches, branch predictor, register files and TLBs, are major contributors to the energy dissipated by processors in deep sub-micron technologies. High leakage also increases chip temperature and some SRAM-based structures become thermal hotspots. Previous work has addressed major sources of SRAM leakage in memory cells and bit-lines, making remaining SRAM components, in particular large drivers, the primary source of leakage. This paper proposes an approach to reduce this source of leakage in all major SRAM-based units of the processor, controlling them in a uniform way, yet treating each unit individually based on its behavior and memory organization. The new approach uses multiple bias voltages in sleep transistors allowing a trade-off between leakage reduction and wakeup delay in multi-stage peripheral drivers. Four low-power modes are defined, from basic to ultra low power, and SRAMs dynamically transition between these modes to minimize leakage without sacrificing performance. A novel control mechanism monitors and predicts future processor behavior for mode control. The leakage reduction in individual units is evaluated and shown to vary from 25% for IL1 to 75% for L2 caches. Resulting temperature reduction, including the effect of positive feedback between temperature and leakage power, is evaluated. A significant temperature reduction is achieved in each unit. It is also shown to reduce hot spots in the instruction TLB and branch predictor.
机译:片上SRAM中的泄漏电流:高速缓存,分支预测器,寄存器文件和TLB是造成深亚微米技术中处理器耗散能量的主要因素。高泄漏还会提高芯片温度,并且某些基于SRAM的结构会成为热点。先前的工作已经解决了存储单元和位线中SRAM泄漏的主要根源,使其余SRAM组件(尤其是大型驱动器)成为泄漏的主要根源。本文提出了一种方法来减少处理器的所有主要基于SRAM的单元中的泄漏源,以统一的方式对其进行控制,并根据其行为和内存组织对每个单元进行单独处理。新方法在睡眠晶体管中使用多个偏置电压,从而可以在多级外围驱动器中的泄漏减少与唤醒延迟之间进行权衡。定义了四种低功耗模式,从基本功耗到超低功耗,SRAM在这些模式之间动态转换,以在不牺牲性能的情况下将泄漏降至最低。一种新颖的控制机制可以监视和预测未来的处理器行为,以进行模式控制。对各个单元的泄漏减少进行了评估,结果显示从IL1的25%到L2缓存的75%不等。评估了由此导致的温度降低,包括温度和泄漏功率之间的正反馈效应。每个单元均实现了显着的温度降低。它还显示可以减少指令TLB和分支预测器中的热点。

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