New Single Wafer Double Sided Spin Cleaning Method

摘要

Many different approaches are taken to enhance the cleaning technology for the semiconductor industry, both in terms of the chemistry and process equipment used. In respect to chemistry well known methods as the IMEC~(TM) clean [1], the evaluation of diluted cleaning chemistry (RCA), the DDC and the Sony clean [2] have proved adaptable over time. With respect to process equipment the venerable wet bench now in circulation for over 25 years has managed to remain central to cleaning strategies. However in the emerging 300 mm wafer era most processes show a trend to single wafer tools due to technological and production flow reasons, resulting in concerted efforts to provide the industry with a new generation of cleaning techniques and process equipment. The paper will discuss how to combine the advantages of the DIO_3 / DHF clean to provide the same or better process performance especially in wafer uniformity, while showing a much lower Cost of Ownership (CoO). Also demonstrated is a reduction in chemical usage, better wafer environmental protection due to cross contamination avoidance and watermark creation.