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Novel Buried Field Rings Edge Termination for 4H-SiC High-Voltage Devices

机译:用于4H-SiC高压器件的新型掩埋场环边缘端接

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This paper is concerned with a numerical study of a novel edge termination technique for 4H-SiC high voltage devices. For the first time, Buried Field Rings (BFRs) are proposed to be used in SiC devices as an effective termination method and the concept is numerically demonstrated for 4H-SiC MESA JFET structures. By using 4 BFRs at the periphery of a MESA JFET, a breakdown voltage of 1590V has been achieved, representing more than 90% of the ideal bulk breakdown value (1750V). The doping concentration sensitivity of the rings and the effect of the SiC/SiO_2 interface charge on the blocking capability are studied, evidencing the robustness of the novel concept in terms of process conditions and doping variations. For comparison, some results for GRs and JTE are also presented.
机译:本文涉及一种用于4H-SiC高压器件的新型边缘终止技术的数值研究。首次提出将掩埋场环(BFR)用作SiC器件的有效端接方法,并对该概念进行了4H-SiC MESA JFET结构的数值验证。通过在MESA JFET的外围使用4个BFR,实现了1590V的击穿电压,占理想整体击穿值(1750V)的90%以上。研究了环的掺杂浓度敏感性以及SiC / SiO_2界面电荷对阻挡能力的影响,从工艺条件和掺杂变化方面证明了该新概念的鲁棒性。为了进行比较,还介绍了GRs和JTE的一些结果。

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