首页> 外文会议>4th European Conference on Silicon Carbide and Related Materials (ECSCRM 2002); Sep 2-5, 2002; Linkoeping, Sweden >D_(II) PL Intensity Dependence on Dose, Implantation Temperature and Implanted Species in 4H- and 6H-SiC
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D_(II) PL Intensity Dependence on Dose, Implantation Temperature and Implanted Species in 4H- and 6H-SiC

机译:D_(II)PL强度与4H-和6H-SiC中剂量,注入温度和注入物种的关系

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摘要

In most semi-conductor processing ion implantation is a key technology. The drawback of ion implantation is that a great deal of lattice defects, such as vacancies, interstitials, anti sites and complexes, are introduced. The annealing behaviour of these defects is important for the viability of ion implantation as a commonly used method. In SiC a defect that is only seen after ion implantation and not after irradiation with neutrons or electrons is the D_(II) defect. The use of Si or C as implanted species have made it possible to investigate the D_(II) photoluminescence (PL) intensity dependence on an excess of either of the two constituents in SiC. The effect of performing a hot implant at 600℃ compared to a room temperature implant was also looked into. The D_(II) PL intensity was measured after a 1500℃ anneal. When the implantation was performed at room temperature the C implanted samples showed a significantly higher D_(II) luminescence than the Si implanted. This makes it tempting to assume that a surplus of C and likely C interstitials are involved in the defect formation. However, when the implantation is done at 600℃ the difference between Si and C implanted samples almost disappears and a slightly higher D_(II) intensity can be seen in the Si implanted samples. This effect may be due to the mobility of C interstitials at temperatures above 500℃. This clearly demonstrates the effect of hot implantation that there is a major change in D_(II) PL intensity even after a 1500℃ anneal.
机译:在大多数半导体工艺中,离子注入是一项关键技术。离子注入的缺点是引入了大量的晶格缺陷,例如空位,间隙,反位和络合物。这些缺陷的退火行为对于作为常用方法的离子注入的可行性很重要。在SiC中,D_(II)缺陷仅在离子注入后才能看到,而在中子或电子辐照后才可见。使用Si或C作为注入物质可以研究D_(II)光致发光(PL)强度对SiC中两种成分中任一成分的过量依赖性。还研究了在室温下进行600℃热植入的效果。在1500℃退火后测量D_(II)PL强度。当在室温下进行注入时,C注入的样品显示出比Si注入明显更高的D_(II)发光。这使人们很容易假设缺陷的形成涉及过多的C和可能的C插页式广告。然而,当在600℃下进行注入时,Si和C注入样品之间的差异几乎消失,并且在Si注入样品中可以看到稍高的D_(II)强度。这种影响可能是由于C间隙在500℃以上的温度下的迁移率所致。这清楚地证明了热注入的效果,即即使在1500℃退火后,D_(II)PL强度也会发生重大变化。

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