Odd-Form Factor Package Wire Bond Case Studies

摘要

Although there is continued effort in the semiconductor packaging industry to reduce package size along withrnthe never ending pursuit of cost savings, there remain a significant number of applications which require a wildlyrndifferent set of capabilities for wire bonding. This paper will explore the wire bonding requirements of severalrndevice cases that could be considered odd form factor package formats when compared to mainstreamrnsemiconductor packaging. Example cases are presented to show the challenges and solutions to wire bondrnpackages in the RF, Automotive, and Optical markets with large form factor (12inch x 6inch), deep reach (0.535rninch), leads, pins, and other challenges.