Mechanically Punched Micro Via Fabrication Process in LCP Substrate for RF-MEMS and Related Electronic Packaging Applications

摘要

The objective of this paper is to present the understanding of micro via fabrication process usingrnmechanical punching on liquid crystal polymer (LCP) substrate. LCP is attracting significant interest in electronicrnpackaging for radio frequency (RF) and microwave applications for its multifarious advantages over therncontemporary substrates used in commercial production. Various surface and subsurface features such as micro viasrnand cavities, at low cost are critical for the fabrication of RF-MEMS packaging. Therefore, there is a need forrnunderstanding micro features, such as via fabrication using different processing techniques. Micro mechanicalrnpunching is one of such via fabrication techniques. Depending upon the package, the size of via could range fromrnfew microns to hundreds of microns. This research has successfully demonstrated the micro mechanical punchingrnprocess for fabrication of through vias of different sizes and pitch on LCP substrate along with the detailedrninvestigation of the relationship between material structure and properties affected by the different processrnparameters during the via fabrication steps.