Component Quality and Technology Group, Cisco Systems, Inc., San Jose, CA, USArnweidong.xie@cisco.com;
rnComponent Quality and Technology Group, Cisco Systems, Inc., San Jose, CA, USA;
rnComponent Quality and Technology Group, Cisco Systems, Inc., San Jose, CA, USA;
Pb-free; solder joint; reliability; stochastic; data analysis;
机译:使用低熔点无铅合金返工的不同BGA的焊点可靠性
机译:电解Ni BGA衬底上无铅Sn-Ag-Cu焊料的IMC形态,界面反应和接头可靠性
机译:无铅焊料和铅锡焊料的BGA-IC封装的振动疲劳可靠性
机译:PB无版BGA焊点可靠性数据分析
机译:使用BGA封装的焊点可靠性评估:Megtron 6与FR4印刷电路板的跌落测试
机译:锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
机译:无铅BGa焊球内空洞形成对机械接头强度的影响