首页> 外文会议>33rd annual symposium on foundations of computer science >Whole-chip ESD protection scheme for CMOS mixed-mode IC's indeep-submicron CMOS technology
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Whole-chip ESD protection scheme for CMOS mixed-mode IC's indeep-submicron CMOS technology

机译:CMOS混合模式IC的深亚微米CMOS技术的全芯片ESD保护方案

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A whole-chip ESD protection scheme with the ESD-connection diodesnand a substrate-triggering field-oxide device (STFOD) are proposed tonprotect mixed-mode CMOS IC's against ESD damage. The STFOD is triggerednon by the substrate-triggering technique to make an area-efficientnVDD-to-VSS ESD clamp circuit. The ESD-connection diodes provide thencurrent discharging paths among the multiple separated power lines tonavoid the ESD damage located at the digital-analog interface. Thisnwhole-chip ESD protection scheme has been practically verified in annL-bits DAC chip in a 0.6-μm CMOS process with a pin-to-pin ESDnrobustness of above 4 KV
机译:提出了一种采用ESD连接二极管和触发衬底的场氧化器件(STFOD)的全芯片ESD保护方案,以防止ESD损坏。 STFOD不受衬底触发技术触发,从而形成了面积有效的nVDD至VSS ESD钳位电路。然后,ESD连接二极管在多条分开的电源线之间提供电流放电路径,从而避免位于数模界面的ESD损坏。这种全芯片ESD保护方案已在nL位DAC芯片中以0.6μmCMOS工艺进行了实践验证,引脚到引脚ESD的鲁棒性高于4 KV

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