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Design and ESD protection of wideband, radio frequency integrated circuits in CMOS technologies.

机译:CMOS技术中的宽带射频集成电路的设计和ESD保护。

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摘要

This work focuses on the design and electrostatic discharge (ESD) protection of wideband integrated circuits operating at frequencies up to 10 GHz. At these high frequencies, the shunt capacitance of ESD protection structures corrupts the termination impedance of the input/output (I/O) circuit. This reduces power transfer into and out of the circuit, increases noise figure and signal distortion, reduces gain and bandwidth, and adds to intersymbol interference in backplane channels. In other words, the performance of radio frequency (RF) I/O circuits can be severely degraded with the implementation of ESD protection.;In order to mitigate the undesirable effects ESD protection has on these I/Os, improvements must be made to the ESD device structures themselves as well as the I/O circuit topology chosen. In this work, layout optimization of ESD diodes in terms of metal routing and diode diffusion geometry in 180-nm (BiCMOS) and 90-nm (CMOS) process technologies is performed to lower the parasitic capacitance of these structures, while maintaining an acceptable current handling capability and on-resistance. In addition, the testing methodology for the characterization of these devices is described.;In addition to lowering the capacitance of the ESD devices themselves, this work also researches possible wideband circuit topologies that are amenable for ESD protection. However, most of these wideband topologies utilize large amounts of die area, thereby increasing manufacturing cost. Here, an ESD-protected CMOS low-noise amplifier (LNA) for 3-10 GHz ultra-wideband (UWB) applications is presented. The LNA exhibits a 4.25-kV ESD protection level along with an S21 of 15 dB and a noise figure of 6 dB across the entire UWB band. The LNA presented here utilizes only two inductors for die area minimization and dissipates 7.9 mW of power from a 1.8-V supply.;Finally, the work concludes with a summary of the design of a 6.25-Gb/s serial I/O transceiver for backplane communications that implements error correction coding to reduce equalization power and transmitter output swing. The design of the transmit driver with pre-emphasis equalization, receiver amplifier, and voltage controlled oscillator is described. The I/O transceiver is fully ESD-protected with an expected 2-kV human body model failure threshold.
机译:这项工作的重点是工作频率高达10 GHz的宽带集成电路的设计和静电放电(ESD)保护。在这些高频下,ESD保护结构的并联电容会破坏输入/输出(I / O)电路的终端阻抗。这减少了进出电路的功率传输,增加了噪声系数和信号失真,降低了增益和带宽,并增加了背板通道中的符号间干扰。换句话说,实施ESD保护会严重降低射频(RF)I / O电路的性能。为了减轻ESD保护对这些I / O的不良影响,必须对这些I / O进行改进。 ESD设备自身结构以及所选的I / O电路拓扑。在这项工作中,对ESD二极管的布局进行了优化,包括在180nm(BiCMOS)和90nm(CMOS)工艺技术中的金属布线和二极管扩散几何形状,以降低这些结构的寄生电容,同时保持可接受的电流处理能力和导通电阻。此外,还描述了用于表征这些器件的测试方法。除了降低ESD器件本身的电容之外,这项工作还研究了可能适用于ESD保护的宽带电路拓扑。然而,大多数这些宽带拓扑利用大量的管芯面积,从而增加了制造成本。在此,介绍了适用于3-10 GHz超宽带(UWB)应用的ESD保护的CMOS低噪声放大器(LNA)。该LNA表现出4.25 kV ESD保护等级,S21为15 dB,在整个UWB频段上的噪声系数为6 dB。此处介绍的LNA仅利用两个电感器来最小化芯片面积,并从1.8V电源消耗7.9mW的功率。最后,本文最后总结了6.25Gb / s串行I / O收发器的设计总结。背板通信,该通信实现了纠错编码以减少均衡功率和发射机输出摆幅。描述了具有预加重均衡的发射驱动器,接收器放大器和压控振荡器的设计。 I / O收发器具有预期的2kV人体模型故障阈值,具有完全ESD保护。

著录项

  • 作者

    Bhatia, Karan Singh.;

  • 作者单位

    University of Illinois at Urbana-Champaign.;

  • 授予单位 University of Illinois at Urbana-Champaign.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2008
  • 页码 159 p.
  • 总页数 159
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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