首页> 外文会议>32nd European Solid-State Device Research Conference (ESSDERC 2002), Sep 24-26, 2002, Firenze, Italy >SiGe pMOSFETs Fabricated on Novel SiGe Virtual Substrates Grown on 10μm x10μm Pillars
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SiGe pMOSFETs Fabricated on Novel SiGe Virtual Substrates Grown on 10μm x10μm Pillars

机译:在10μmx10μm柱上生长的新型SiGe虚拟衬底上制造的SiGe pMOSFET

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Silicon germanium pMOSFETs have been fabricated on novel silicon germanium virtual substrates. The SiGe virtual substrates were grown by MBE on 10μmx10μm silicon pillars fabricated by dry etching trenches into the original silicon substrate. The pillars promote relaxation of the SiGe virtual substrate and reduce cross hatch on the wafer surface. The devices have 5nm silicon germanium active layer with a germanium content of 70% grown on top of a relaxed virtual substrate with a germanium content of 30%. A 2nm silicon cap separates the SiGe channel from the gate oxide. Device characteristics show a improvement in on state drive current in these SiGe devices of 40% over their conventional silicon counterparts.
机译:硅锗pMOSFET已在新型硅锗虚拟基板上制造。通过MBE在10μmx10μm的硅柱上通过MBE生长SiGe虚拟衬底,该硅柱是通过将沟槽干蚀刻到原始硅衬底中而制成的。柱促进SiGe虚拟衬底的松弛并减少晶片表面上的交叉影线。该器件具有在锗含量为30%的松弛虚拟衬底上生长的锗含量为70%的5nm硅锗活性层。 2nm的硅盖将SiGe沟道与栅极氧化物分开。器件特性表明,与传统的硅器件相比,这些SiGe器件的导通状态驱动电流提高了40%。

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