首页> 外文会议>26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington >Application of Scanning Acoustic Microscopy to Electric and Electronic Parts
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Application of Scanning Acoustic Microscopy to Electric and Electronic Parts

机译:扫描声显微镜在电气电子零件中的应用

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摘要

Ever since the invention of the scanning acoustic microscope (SAM), a key objective has been the enhancement of the resolution in an interior image. Thus, an acoustic lens that can form an interior image with a shear wave has been designed. The use of this lens gives benefits such as an increase of lateral resolution in the interior image, a reduction in background noise caused by surface roughness, and a reduction of spherical aberration. Significantly, with the current trend towards microminiaturization of microelectronic packages, acoustic microscopy with higher resolution and removal of surface roughness can play an important role in diagnostic examinations and failure analysis. In this paper, applications for the lens in microelectronic IC packages will be summarized.
机译:自从扫描声显微镜(SAM)发明以来,关键目标一直是提高内部图像的分辨率。因此,已经设计了可以利用剪切波形成内部图像的声透镜。使用此镜头可带来以下好处,例如,提高内部图像的横向分辨率,减少由于表面粗糙度导致的背景噪声以及减少球差。值得注意的是,随着当前微电子封装朝着微型化的趋势发展,具有更高分辨率和表面粗糙度去除能力的声波显微镜可以在诊断检查和故障分析中发挥重要作用。本文将总结透镜在微电子IC封装中的应用。

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