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26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington

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1.High Temperature Solder (Au/Sn) Failures from Nickel Plating Impurities

机译：镀镍杂质引起的高温焊料（Au / Sn）故障
- 作者：Carl B. Bunis
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
2.Application of Near IR, Phase-Contrast Imaging to Backside Failure Isolation and Analysis

机译：近红外相衬成像技术在背面故障隔离与分析中的应用
- 作者：R. Aaron Falk;Edward W. Budiarto
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
3.Application of Scanning Acoustic Microscopy to Electric and Electronic Parts

机译：扫描声显微镜在电气电子零件中的应用
- 作者：C. Miyasaka;B. R. Tittmann
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
4.Application of TIVA in Design Debug

机译：TIVA在设计调试中的应用
- 作者：Siva Kolachina;Bill Taylor;Kendall Scott Wills;Edward I. Cole
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
5.Automatic IC Die Positioning in the SEM

机译：SEM中自动IC芯片定位
- 作者：H.W. Tan;J.C.H Phang;J.T.L Thong
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
6.Combining FIB sequential cross-sectioning with TEM for small Defect Analysis in SRAM array

机译：将FIB顺序横截面与TEM相结合以进行SRAM阵列中的小缺陷分析
- 作者：Nathan Wang;Rei Fang
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
7.Computerized Quantification of the Dicing Process: The First Step Toward the Next Generation of Related Die Cracking Failure Analysis

机译：切割过程的计算机化量化：迈向下一代相关模具破裂失效分析的第一步
- 作者：Doug Glover;John R. Lynch;Irvin Huseby
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
8.Contrast Inversions in Scanning Acoustic Microscopy (C-SAM) of Glue Die Attach

机译：胶模附着的扫描声显微镜（C-SAM）中的对比度倒置
- 作者：Boris Plikat
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
9.Contactless Voltage and Current Contrast Imaging with Scanning Force Microscope Based Test Systems

机译：基于扫描力显微镜的测试系统的非接触式电压和电流对比成像
- 作者：W. Mertin;S.-W. Bae;U. Behnke;R. Weber;E. Kubalek
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
10.ESD Effects on Electromigration Performance of Aluminum Metallization System

机译：ESD对铝金属化系统电迁移性能的影响
- 作者：J. E. Vinson;M. J. Dion
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
11.Guidelines for Two-Dimensional Dopant Profiling using SCM

机译：使用SCM进行二维掺杂物分析的指南
- 作者：Axel Born;R. Wiesendanger
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
12.Failure Analysis of Stacked-Chip Scale Package

机译：堆叠式电子秤包装的失效分析
- 作者：Christopher C. Flores
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
13.Failure Analysis from the Back Side of a Die

机译：模具背面的故障分析
- 作者：Silke Liebert
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
14.Failure Analysis of MEMS Using Thermally-Induced Voltage Alteration

机译：热感应电压变化对MEMS的失效分析
- 作者：Jeremy A. Walraven;Edward I. Cole;Paiboon Tangyunyong
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
15.Focused Ion Beam Analysis of Organic Low-k Dielectrics

机译：有机低k电介质的聚焦离子束分析
- 作者：H. Bender;R. A. Donaton
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
16.Failure Analysis of CDM ESD Damage in a GaAs RFIC

机译：GaAs RFIC中CDM ESD损坏的失效分析
- 作者：Amy Poe;Steve Brockett;Tony Rubalcava
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
17.Failure Analysis of Killer Defects and Yield Enhancement of Flat ROM Devices in Wafer Fabrication

机译：晶圆制造中ROM杀手缺陷的失败分析和良率提高
- 作者：Y. N. Hua;Z. R. Guo;L. H. An;Shailesh Redkar
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
18.In-line Defect to Bitmap Signature Correlation: A Shortcut to Physical FA Results

机译：与位图签名相关的在线缺陷：物理FA结果的捷径
- 作者：Julie Segal;Arman Sagatelian;Bob Hodgkins;Tom Ho;Ben Chu;Tony Singh;Harvey Berman
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
19.Forensic Microscopy in the Failure Analysis Laboratory

机译：故障分析实验室中的法医显微镜
- 作者：William E. Vanderlinde;David A. Stoney
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
20.Local Electrical Thickness-mapping of Thin Oxides with Conducting Atomic Force Microscopy

机译：薄层氧化物的局部电厚度映射与导电原子力显微镜
- 作者：Alexander Olbrich;Bernd Ebersberger;Christian Boit
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
21.Integrated Circuit Waveform Probing Using Optical Phase Shift Detection

机译：使用光相移检测的集成电路波形探测
- 作者：Ken Wilsher;William Lo;Travis Eiles;Guoqing Xiao
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
22.Liquid-metal Embrittlement of Copper Wires

机译：铜线的液态金属脆化
- 作者：L. E. Brown
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
23.Near IR Absorption in Heavily Doped Silicon ― An Empirical Approach

机译：重掺杂硅中的近红外吸收-一种经验方法
- 作者：R. Aaron Falk
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
24.Measurement of Interfacial Adhesion and its Degradation in Multi-layer Packages, Devices, and Blanket Films using the Laser Spallation Technique

机译：使用激光剥落技术测量多层包装，器件和毯状薄膜中的界面粘附性及其降解
- 作者：Vijay Gupta;Robert Hernandez;Rajen Dias;Vasudeva Atluri;George Raiser;Mike Mello;Lars Skoglund;Paul Zimmerman
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
25.New Laser Ablation Method for Non-Destructive Backside Sample Preparation

机译：用于无损背面样品制备的新激光烧蚀方法
- 作者：F. Beaudoin;P. Perdu;F. Saviot;D. Lewis;F. Salin
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
26.X-Ray Tomography for Electronic Packages

机译：电子封装的X射线断层扫描
- 作者：Deepak Goyal
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
27.A Novel Method to Analyze the Deep Trench Capacitors in DRAM

机译：一种分析DRAM中深沟道电容器的新方法
- 作者：Jack Lee;Kuo-Hui Huang;Jen-Lang Lue
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
28.A Study on the Yield Loss Due to Al (Cu) Interconnections with Spacing Failure

机译：Al（Cu）互连导致间距损失的屈服损失研究
- 作者：Ruey Lian Hwang;Yung-Sheng Huang;Ying-Lang Wang;Ming-Jer Lee
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
29.A Comparison of Backside Emission Microscopy Systems

机译：背面发射显微镜系统的比较
- 作者：Brennan Davis
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
30.Planar TEM Analysis of Nanoindented Samples Using the Focused Ion Beam Lift-out Technique

机译：聚焦离子束提升技术对纳米压痕样品进行平面TEM分析
- 作者：T. L. Shofner;J.L. Drown;S. R. Brown;B.B. Rossie;M. A. Decker;Y. S. Obeng;F. A. Stevie
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
31.Transmission Line Pulse Testing of the ESD Protection Structures of ICs.- A Failure Analysts Perspective

机译：集成电路ESD保护结构的传输线脉冲测试-故障分析者的观点
- 作者：Leo G. Henry;Jon Barth;John Richner;Koen Verhaege
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
32.UV Reflectance Spectroscopy of the Copper/Copper Oxide System for Assessment of Solderability

机译：铜/铜氧化物体系的紫外反射光谱法，用于评估可焊性
- 作者：L. Forney;C. Thierolf;B. Toleno;G. Parks
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
33.Time Domain Reflectometry as a Device Packaging Level Failure Analysis and Failure Localization Tool

机译：时域反射法作为设备包装级故障分析和故障定位工具
- 作者：Damion Searls;Anura Don;Emilie Dy;Deepak Goyai
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
34.Selective Au Etching in Au/AI Bonds in Current IC Technology

机译：当前IC技术中Au / AI键的选择性Au蚀刻
- 作者：M. Vanzi;A. Serpe;E.F. Trogu;P. Deplano;C. Hartfield;W. Subido
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
35.Thermal Fatigue Induced Voiding in LDMOS Transistors Submitted to Multiple Energy Discharges

机译：LDMOS晶体管中的热疲劳引起的空洞使多种能量释放
- 作者：I. Garcon;J.M. Bosc;C. Levade;M. Cabie;G. Vanderschaeve
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
36.EOS Simulation and Failure Analysis of Metallurgically Bonded Silicon Diodes.

机译：冶金结合硅二极管的EOS模拟和失效分析。
- 作者：Alexander Teverovsky
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
37.Failure Analysis and Elimination of Galvanic Corrosion on Bondpads During Wafer Sawing

机译：晶圆切割过程中键合垫上的电偶腐蚀失效分析和消除
- 作者：Y. N. Hua;E. C. Low;L. H. An;Shailesh Redkar
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
38.Evaluation of On-Chip ESD Supply Clamp Robustness by In-situ Floating Power Bus Monitoring

机译：通过现场浮动电源总线监控评估片上ESD电源夹的鲁棒性
- 作者：Michael Fliesler;Ian Morgan
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
39.Application of KOH Electrochemical Etch and Passive Voltage Contrast Techniques to Identify Leaky Gate in Deep Submicron CMOS

机译：KOH电化学刻蚀与无源电压对比技术在深亚微米CMOS漏栅识别中的应用
- 作者：Fred Y. Chang;Victer Chan
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
40.Antireflection Coatings for Semiconductor Failure Analysis

机译：用于半导体失效分析的抗反射涂层
- 作者：Brennan Davis;Wilson Chi
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
41.Analysis of Leakage Failures in Flash Memory Devices and Root Cause Identification

机译：闪存设备泄漏故障分析和根本原因识别
- 作者：N. De Luna;M. Del Fierro;J. Munoz
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
42.Application of Single Contact Optical Beam Induced Currents (SCOBIC) for Backside Failure Analysis

机译：单触点光束感应电流（SCOBIC）在背面故障分析中的应用
- 作者：M. Palaniappan;J.M. Chin;J.C.H. Phang;D.S.H. Chan;C.E. Soh;G. Gilfeather
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
43.Automatic Determination of Optimal FIB Operations for Improved Circuit Probing and Fast Reconfiguration

机译：自动确定最佳FIB操作，以改进电路探测和快速重新配置
- 作者：Romain Desplats;Timothee Dargnies;Jean-Christophe Courrege;Philippe Perdu;Jean-Louis Noullet
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
44.Backside Fault Isolation Using a Magnetic-Field Imaging System on SRAMs with Indirect Shorts

机译：在间接短路的SRAM上使用磁场成像系统进行背面故障隔离
- 作者：L. A. Knauss;B. M. Frazier;A. B. Cawthorne;E. Budiarto;R. Crandall;S. Melnik;C. Bennett
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
45.Characterization and Isolation Techniques in Silicon on Insulator Technology Microprocessor Designs

机译：绝缘子技术微处理器设计中硅的表征和隔离技术
- 作者：T. Kane;M. Cambra;M. Tenney;P. McGinnis;A. Domenicucci;Y. Wang;D. Falcon
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
46.Case Studies of Brittle Interfacial Failures in Area Array Solder Interconnects

机译：面阵焊接互连中脆性界面故障的案例研究
- 作者：George M. Wenger;Richard J. Coyle;Patrick P. Solan;John K. Dorey;Courtney V. Dodd;Robert Erich;Anthony Primavera
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
47.Comparative Study of Sample Preparation Techniques for Backside Analysis

机译：背面分析样品制备技术的比较研究
- 作者：Philippe Perdu;Romain Desplats;Felix Beaudoin
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
48.Electronic Package Failure Analysis Using TDR

机译：使用TDR的电子包装故障分析
- 作者：Dima A. Smolyansky
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
49.Data Analysis Tools and Methodologies for Quick Yield Learning in a High Volume Manufacturing Environment

机译：大规模生产环境中用于快速产量学习的数据分析工具和方法
- 作者：L. Andrade;T. Taylor
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
50.Embedded SRAM Bitmapping and Failure Analysis for Manufacturing Yield Improvement

机译：嵌入式SRAM位图和故障分析可提高制造良率
- 作者：Jean-Yves Glacet;Fourmun Lee
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
51.EOS Simulation and Failure Analysis of Metallurgically Bonded Silicon Diodes

机译：冶金结合硅二极管的EOS仿真和失效分析
- 作者：Alexander Teverovsky
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
52.Embedded Memory Analysis for Standard Cell ASIC Yield Enhancement

机译：嵌入式存储器分析可提高标准单元ASIC的良率
- 作者：Cary A. Gloor
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
53.Failure Analysis of Flip Chip Bumps after Thermal Stressing

机译：热应力后倒装芯片凸块的失效分析
- 作者：Tejpal K. Hooghan;Kultaransingh Hooghan;Sho Nakahara;Robert K. Wolf;Robert W Privette;Ralph S. Moyer
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
54.Failure Analysis Process Flow and Common Failure Mechanisms in Flip-chip Packaged Devices

机译：倒装芯片封装器件的故障分析流程和常见故障机制
- 作者：Steve Hsiung;Victer Chan
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
55.Failure Analysis of Tungsten Stud Defects from the CMP Process

机译：CMP工艺产生的钨钉缺陷的失效分析
- 作者：K.Takagi;Y. Kohno;S. Nukii
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
56.Failure Analysis of a Transistor Lead

机译：晶体管引线的故障分析
- 作者：Yasushi Deguchi;Sumio Matsuda;Jiro Aoki;Takashi Tamura;Yasunobu Iwai;Shigeki Kikui
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
57.Humidity-Bias Driven Shorts in Multilayer Circuits: A Case Study in Failure Analysis

机译：多层电路中由湿气引起的短路：故障分析中的案例研究
- 作者：Hei-Ruey Harry Jen;Gerald S. DUrso;Harold Andrews
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
58.Identification and Analysis of Parasitic Depletion Mode Leakage in a Memory Select Transistor

机译：存储器选择晶体管中寄生耗尽模式泄漏的识别和分析
- 作者：Jim Colvin;Anirban Roy
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
59.Integrated Circuit SNR improvement using Dielectric Altering Compound, Laser Trim, and FIB system

机译：使用介电替代化合物，激光微调和FIB系统改善集成电路SNR
- 作者：B.J. Dutt;J.J. Kroutch;K.N. Hooghan;R.J. Jenkins;M.J. Toth
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
60.LSI Process Diagnosis for Device Users

机译：设备用户的LSI流程诊断
- 作者：Miki Imai;DaikiTanaka;Katsuhiko Hosoda;Katsuhumi Noda;Sumio Matsuda
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
61.Laser Voltage Probe (LVP): A Novel Optical Probing Technology for Flip-Chip Packaged Microprocessors

机译：激光电压探针（LVP）：一种用于倒装芯片封装微处理器的新型光学探测技术
- 作者：Wai Mun Yee;Mario Paniccia;Travis Eiles;Valluri Rao
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
62.A Focused Ion Beam Technique to Electrically Contact the Deep Trench Capacitor of a Single Active Memory Cell in the Sub 0.25μm Technology Regime

机译：在0.25μm以下技术领域中，一种聚焦离子束技术可以电接触单个有源存储单元的深沟槽电容器
- 作者：Gunnar Zimmermann;Mark Johnston;Rolf Christ
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
63.New FIB-Supported Approach for Wirebond Characterization

机译：新的FIB支持的焊线表征方法
- 作者：Peter Jacob;Giovanni Nicoletti
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
64.Passive Voltage Contrast Application on Analysis of Gate Oxide Failure in 0.25 μm Technology

机译：无源电压对比技术在0.25μm技术栅氧化层失效分析中的应用
- 作者：Song Zhigang;Loh Sock Khim;Shailesh Redkar
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
65.SMT Ceramic Capacitor Failure Mechanisms, Isolation Tools, Techniques and Analysis Methods

机译：SMT陶瓷电容器的失效机理，隔离工具，技术与分析方法
- 作者：Ralph A. Carbone;David J. Roche
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
66.UTC Clinic Hospital Network: Description of International Network of Failure Analysis Labs and Case Studies

机译：UTC诊所医院网络：国际故障分析实验室网络和案例研究的说明
- 作者：Timothy Wilkins
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
67.Wafer Conserving Full Range Construction Analysis for IC Fabrication and Process Development Based on FIB /Dual Beam Inline Application

机译：基于FIB /双光束在线应用的IC制造和工艺开发晶圆保护全过程构造分析
- 作者：R. Weiland;C. Boit;N. Dawes;A. Dziesiaty;E. Demm;B. Ebersberger;L. Frey;S. Geyer;A. Hirsch;C. Lehrer;P. Meis;M. Kamolz;H. Lezec;H. Rettenmaier;W. Tittes;R. Treichler;H. Zimmermann
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
68.Yield Enhancement Study: Process Variation and Design Margins Leading to Timing Issues in RAM

机译：良率提高研究：导致RAM中时序问题的工艺变化和设计裕度
- 作者：Srikanth Perungulam;Scott Wills;Greg Mekras
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
69.pn-Junction Delineation in Si Devices Using Scanning Capacitance Spectroscopy

机译：利用扫描电容光谱法在硅器件中进行pn结描绘
- 作者：Hal Edwards
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
70.Passivation Cracks in a Four-Level Metal Low-k Dielectric Backend Process

机译：四层金属低k介电后端工艺中的钝化裂纹
- 作者：Michael C. Olewine;John F. DiGregorio;Gus J. Colovos;Kevin F. Saiz;Hongjiang Sun
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
71.Specific Area Planar and Cross-Sectional Lift-Out Techniques: Procedures and Novel Applications

机译：特定区域的平面和横断面提升技术：程序和新颖的应用
- 作者：Raghaw Rai;Swaminathan Subramanian;Stewart Rose;James Conner;Phil Schani;Jamey Moss
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
72.Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis Microcharacterisation

机译：扫描电子声学显微镜：用于失效分析和微表征的新型工具
- 作者：WK Wong;QR Yin;JTL Thong;JCH Phang;JW Fang
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
73.Reducing Top-of-Die Plastic Delamination by Assuring Pre-Mold Cleanliness of Die Surfaces

机译：通过确保模具表面的铸模清洁度来减少模具顶部的塑料分层
- 作者：R.K. Lowry;J.H. Linn;A.L. Northen;J.R. Zalnoski;H.W. Satterfield
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
74.Semiconductor Wear Out at Nuclear Power Plants

机译：核电厂的半导体用尽
- 作者：James B. Riddle
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
75.Temperature Distributions in Ⅲ-Ⅴ and SiC Micro-Wave Power Transistors Using Spatially Resolved Photoluminescence and Raman- Spectrometry Mapping Respectively

机译：分别使用空间分辨光致发光和拉曼光谱图绘制Ⅲ-Ⅴ和SiC微波功率晶体管中的温度分布
- 作者：P. Martin;R. Bisaro;C. Dua;O. Noblanc;S. L. Delage;D. Floriot;F. Lemaire;P. Galtier;J.-P. Landesman;C. Brylinski
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
76.Silicon Trenching Using Dry Etch Process for Back Side FIB and Probing

机译：使用干法刻蚀工艺进行背面FIB和探测的硅沟槽
- 作者：Valentina Korchnoi;Amos Fenigstein;Anastasia Barger
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
77.The Use of TMAH to Etch Silicon and Expose Metal Bridging Failures

机译：使用TMAH蚀刻硅并暴露金属桥接故障
- 作者：Mark Morris;James Mohr;Esteban Ortiz;Steven Englebretson
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年
78.Transparent Heat Spreader for Backside Optical Analysis of High Power Microprocessors

机译：透明散热器，用于大功率微处理器的背面光学分析
- 作者：Travis M. Eiles;Dean Hunt;David Chi
- 会议名称：《26th International Symposium for Testing and Failure Analysis, Nov 12-16, 2000, Bellevue, Washington》 | 2000年