首页> 外文会议>25th Annual BACUS Symposium on Photomask Technology pt.1 >A Mask Manufacturer's Perspective on Maskless Lithography
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A Mask Manufacturer's Perspective on Maskless Lithography

机译:掩模制造商对无掩模光刻的看法

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Maskless Lithography (ML2) is again being considered for use in mainstream CMOS IC manufacturing. Sessions at technical conferences are being devoted to ML2. A multitude of new companies have been formed in the last several years to apply new concepts to breaking the throughput barrier that has in the past prevented ML2 from achieving the cost and cycle time performance necessary to become economically viable, except in rare cases. Has Maskless Lithography's (we used to call it "Direct Write Lithography") time really come? If so, what is the expected impact on the mask manufacturer and does it matter? The lithography tools used today in mask manufacturing are similar in concept to ML2 except for scale, both in throughput and feature size. These mask tools produce highly accurate lithographic images directly from electronic pattern files, perform multi-layer overlay, and mix-n-match across multiple tools, tool types and sites. Mask manufacturers are already accustomed to the ultimate low volume - one substrate per design layer. In order to achieve the economically required throughput, proposed ML2 systems eliminate or greatly reduce some of the functions that are the source of the mask writer's accuracy. Can these ML2 systems meet the demanding lithographic requirements without these functions? ML2 may eliminate the reticle but many of the processes and procedures performed today by the mask manufacturer are still required. Examples include the increasingly complex mask data preparation step and the verification performed to ensure that the pattern on the reticle is accurately representing the design intent. The error sources that are fixed on a reticle are variable with time on an ML2 system. It has been proposed that if ML2 is successful it will become uneconomical to be in the mask business - that ML2, by taking the high profit masks will take all profitability out of mask manufacturing and thereby endanger the entire semiconductor industry. Others suggest that a successful ML2 system solves the mask cost issue and thereby reduces the need and attractiveness of ML2. Are these concerns valid? In this paper we will present a perspective on maskless lithography from the considerable "direct write" experience of a mask manufacturer. We will examine the various business models proposed for ML2 insertion as well as the key technical challenges to achieving simultaneously the throughput and the lithographic quality necessary to become economically viable. We will consider the question of the economic viability of the mask industry in a post-ML2 world and will propose possible models where the mask industry can meaningfully participate.
机译:无掩模光刻(ML2)再次被考虑用于主流CMOS IC制造中。技术会议上的会议专门讨论ML2。在过去的几年中,已经成立了许多新公司,以应用新的概念来突破吞吐量障碍,而在过去,ML2无法实现经济可行所需的成本和周期时间性能,但极少数情况除外。无掩模光刻技术(我们以前称之为“直接书写光刻”)的时间真的到了吗?如果是这样,对口罩制造商的预期影响是什么?如今,在掩模制造中使用的光刻工具在概念上与ML2相似,除了在生产量和特征尺寸方面的规模外,其他都是这样。这些掩膜工具直接从电子图案文件中生成高精度的平版印刷图像,执行多层覆盖,并跨多个工具,工具类型和位置进行n匹配。掩模制造商已经习惯了极小的体积-每个设计层仅需一个基板。为了实现经济上需要的吞吐量,建议的ML2系统消除或大大减少了某些功能,这些功能是掩模写入器精度的来源。没有这些功能,这些ML2系统能否满足苛刻的光刻要求? ML2可以消除中间掩模版,但是仍然需要掩模制造商执行的许多过程和步骤。例子包括越来越复杂的掩模数据准备步骤和执行的验证,以确保掩模版上的图案准确地代表了设计意图。在ML2系统上,固定在标线板上的错误源随时间变化。已经提出,如果ML2成功,则进入掩模业务将变得不经济-ML2通过采用高利润的掩模将使掩模生产中的所有盈利能力丧失,从而危及整个半导体行业。其他人则认为,成功的ML2系统可以解决掩模成本问题,从而减少ML2的需求和吸引力。这些担忧有效吗?在本文中,我们将从掩模制造商的大量“直接写入”经验中介绍无掩模光刻技术的观点。我们将研究为ML2插入而提出的各种商业模型,以及在实现经济上可行的同时实现产量和光刻质量方面所面临的主要技术挑战。我们将考虑在后ML2时代世界中面具行业的经济生存能力问题,并将提出可能使面具行业有意义地参与其中的模型。

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