Review of board-level solder joint reliability under environmental stress

摘要

The reliability of board-level solder joint that provides the mechanical and electrical connections between the chip and print circuit board is such an import issue that they can result in the failure of the whole equipment under real service condition. The multiple stresses in service environment such as temperature and vibration loadings can cause the fatigue failure of solder joints easily. In this paper, a review was presented on the research situation and prospect of the reliability of solder joints with an emphasis on accelerated tests, numerical simulation and life prediction models. The failure behaviors of solder joints under coupling loadings of temperature and vibration were also introduced which represent the research trend in the future.