Department of Technologies in Electronics, Technical University of Kosice, Kosice, Slovakia;
Department of Technologies in Electronics, Technical University of Kosice, Kosice, Slovakia;
Department of Technologies in Electronics, Technical University of Kosice, Kosice, Slovakia;
Department of Technologies in Electronics, Technical University of Kosice, Kosice, Slovakia;
Institute of Materials Research, Slovak Academy of Sciences, Kosice, Slovakia;
Institute of Materials Research, Slovak Academy of Sciences, Kosice, Slovakia;
Soldering; Substrates; Power electronics; Microassembly; Lead; Spinning;
机译:DBC衬底焊接innolot和Snbi关节的可靠性研究
机译:在300°C时效的银,直接粘结铜(DBC)和铜基板上的无压烧结纳米银接头的显微组织研究和粘结强度
机译:微米尺寸的塑料塑料颗粒直接粘接在化学镜头上的镍氢化合物衬底:低温无压烧结,粘接机构和高温老化可靠性
机译:DBC衬底模具附着的研究
机译:I.界面Diels-Alder反应的物理有机研究。二。设计用于细胞粘附/迁移研究的电活性底物
机译:SiC微型加热器芯片系统和Ag烧结连接法测量各种陶瓷DBC基板上功率模块的散热和热稳定性
机译:具有倒装芯片附件和电气测试结构的柔性聚酰亚胺基板的可靠性研究