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Low temperature Au-Au surface-activated bonding using nitrogen atmospheric-pressure plasma treatment for optical microsystems

机译:用于光学微系统的使用氮气大气压等离子体处理的低温Au-Au表面活化键

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This study investigated the effect of nitrogen (N) atmospheric-pressure (AP) plasma treatment on the Au-Au bonding property. Surface analysis using x-ray photoelectron spectroscopy (XPS) before and after AP plasma treatment with different gases: N and Ar+O was performed. In the case of Ar+O AP plasma treatment, the oxidation of the Au surface (AuO) was detected by the chemical shift of the 4f levels in XPS spectra. In contrast, no oxidation of Au surfaces was observed after N AP plasma treatment. N AP plasma treatment was effective in improving the bondability between Au/Au compared with Ar+O AP plasma treatment (bonding temperature: 150°C).
机译:这项研究调查了氮(N)大气压(AP)等离子体处理对Au-Au键合性能的影响。在用不同气体:N和Ar + O进行AP等离子处理之前和之后,使用X射线光电子能谱(XPS)进行表面分析。在Ar + O AP等离子体处理的情况下,通过XPS光谱中4f含量的化学位移来检测Au表面(AuO)的氧化。相反,在NAP等离子体处理之后未观察到Au表面的氧化。与Ar + O AP等离子体处理相比(键合温度:150°C),NAP等离子体处理可有效改善Au / Au之间的键合性。

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