Center for Microtechnologies, Tech. Univ. Chemnitz, Chemnitz, Germany;
low-k dielectric thin films; sputter etching; DMADMS; OMCTS; ULK materials; bis(dimethylamino)dimethylsilane; evaporated repair liquids insertion; octamethylcyclotetrasiloxane; plasma activated multiple repairing fragments; plasma assisted; plasma damaged ultra low-k materials; remote plasmas; restoration process; size 62 nm; ultra low-k dielectrics; Decision support systems; Dielectrics; Plasmas;
机译:等离子辅助原位修复工艺用于侧壁损坏的ULK电介质
机译:等离子体蚀刻对多孔碳硅烷超低k电介质的破坏研究
机译:受损的超低k电介质原位k恢复过程的理论研究
机译:侧壁损坏超低k电介质等离子辅助等离子体的实验研究
机译:等离子体对多孔低k的损伤机理研究:工艺开发和介电恢复。
机译:甲烷 - 空气纳秒的数值研究脉冲介质阻挡排放等离子体辅助燃烧
机译:使用无氧碳氟化合物等离子体将等离子体损伤和超低k介电薄膜的原位密封降至最低