Plasma cleaning and its application in microwave module wire bonding technology

摘要

Plasma cleaning process which can remove surface contamination from the electrode films on the circuit board becomes more and more important in the microwave module production, since it offers high bondability and reliability of wire bonding. The principle theory of plasma cleaning process was discussed in the paper, the optimal process parameters of plasma claening process were used to improve the wire bonding reliability. The results indicate that with proper process parameters, such as cleaning power and time, Au wire bonding reliability is improved obviously with plasma cleaning process, which can meet the demands of Au wire bonding technology used in hybrid integrated microwave modules. The study can provide refence for the ultrasonic Au wire bonding technology, the design of process control and process optimization in high density and high performance microwave module production.