微波等离子清洗在封装工艺中的应用

摘要

微电子封装过程中产生的沾污严重影响了电子元器件的可靠性和使用寿命。文中研究了用微波等离子清洗封装过程中产生的沾污。研究结果表明，微波等离子清洗能有效增强基板的浸润性，降低芯片和基板共晶焊界面的孔隙率，同时也能清除元件表面的氧化物薄膜和有机物沾污，经过等离子清洗，其键合焊接强度和合金熔封密封性都得到提高。%The reliability and lifetime of electronic component is seriously affected by contamination in the process of assembly. In this paper, the method of microwave plasma cleaning for decontamination has been studied. The results showed that this method could enhance the wettability of substrate and reduce alloy soldering void ratio at the interface between die and substrate, and also could remove the thin oxide films and organic contamination at surfaces. Furthermore, wire bonding strength and alloy sealing hermeticity could be improved by this method.