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Direct bonding for dissimilar metals assisted by carboxylic acid vapor

机译:羧酸蒸气辅助直接键合异种金属

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摘要

A low-temperature low-vacuum direct bonding process for dissimilar metals via surface modification and activation with carboxylic acid vapors has been proposed in this study. Robust joints of Cu/Zn, Cu/Ag and Ni/Zn could be obtained subject to thermal compression at 300 °C. Such joints still possess a shear strength higher than 10 MPa when the testing temperature reaches 250°C. It has great potential for wide applications, especially when low process temperature as well as high operation temperature is desired.
机译:在这项研究中提出了一种通过表面改性和羧酸蒸汽活化对异种金属进行低温低真空直接键合的方法。在300°C的热压下,可以获得坚固的Cu / Zn,Cu / Ag和Ni / Zn接头。当测试温度达到250°C时,此类接头的剪切强度仍高于10 MPa。它具有广泛的应用潜力,尤其是在需要较低的过程温度以及较高的工作温度时。

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