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Direct bonding for dissimilar metals assisted by carboxylic acid vapor

机译:用于羧酸蒸气辅助不同金属的直接粘合

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A low-temperature low-vacuum direct bonding process for dissimilar metals via surface modification and activation with carboxylic acid vapors has been proposed in this study. Robust joints of Cu/Zn, Cu/Ag and Ni/Zn could be obtained subject to thermal compression at 300 °C. Such joints still possess a shear strength higher than 10 MPa when the testing temperature reaches 250°C. It has great potential for wide applications, especially when low process temperature as well as high operation temperature is desired.
机译:本研究提出了通过表面改性和羧酸蒸汽激活的低温低真空直接键合方法。可以在300℃下进行Cu / Zn,Cu / Ag和Ni / Zn的鲁棒关节,但在300℃下进行热压缩。当测试温度达到250℃时,这种接头仍然具有高于10MPa的剪切强度。它具有很大的应用潜力,特别是当需要低处理温度以及高操作温度时。

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