Copper-to-dielectric heterogeneous bonding for 3D integration

机译：用于3D集成的铜-电介质异质键合

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A novel hybrid bonding process has been developed that achieved a successful copper/SiO2 heterogeneous bonding.

机译：已经开发出一种新颖的混合键合工艺，该工艺成功实现了铜/ SiO2异质键合。

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《2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration》|2014年|6-6|共1页
会议地点 Tokyo(JP)
作者
Wei Lin; Juntao Li; Washington Joseph; Rath David; Skordas Spyridon; Kirihata Toshiaki; Winstel Kevin; Peethala Brown; Demarest James; Da Song; Edelstein Daniel; Iyer Subramanian;
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International Business Machines, Albany Nanotech, 257 Fuller Rd. Albany, NY, 12203, USA;

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正文语种 eng
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专利

1. Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration [J] . Ji-Chel Bea, Mariappan Murugesan, Hideto Hashiguchi, Micromachines . 2016,第10期

机译：带有毛细管自组装的氧化物-氧化物热压直接键合技术，用于多芯片至晶圆异质3D系统集成
2. Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration [J] . Pierric Gueguen, Caroline Ventosa, Lea Di Cioccio, Microelectronic Engineering . 2010,第3期

机译：直接键合的物理：应用于3D异构或单片集成
3. Thin Si wafer substrate bonding and de-bonding below 250 degrees C for the monolithic 3D integration [J] . Jeon Yu-Rim, Han Hoonhee, Choi Changhwan Sensors and Actuators, A. Physical . 2018,第期

机译：单片3D集成薄的Si晶片基板粘接和去粘合低于250℃
4. Copper-to-dielectric heterogeneous bonding for 3D integration [C] . Wei Lin, Juntao Li, Washington Joseph, IEEE International Workshop on Low Temperature Bonding for 3D Integration . 2014

机译：三维集成铜 - 介电异构键合
5. 3D Integration of Inverted IndiumGalliumArsenic MSM Array to Silicon Platform by Low Temperature Chip-to-Wafer Bonding. [D] . Wu, Pengfei. 2013

机译：通过低温芯片对晶圆键合将铟镓砷MSM阵列与硅平台进行3D集成。
6. Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration [O] . Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, 2016

机译：带有毛细管自组装的氧化物-氧化物热压直接键合技术用于多芯片至晶圆异质3D系统集成
7. Metal-Alloy Cu Surface Passivation Leads to High Quality Fine-Pitch Bump-Less Cu-Cu Bonding for 3D IC and Heterogeneous Integration Applications [O] . Asisa Kumar Panigrahi, C. Hemanth Kumar, Satish Bonam, 2018

机译：金属合金Cu表面钝化导致用于3D IC和异构整合应用的高质量细间距凸块Cu-Cu键合

Copper-to-dielectric heterogeneous bonding for 3D integration

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