Advanced transient thermoreflectance 2D imaging for integrated circuit sub-micron defect detection and thermal analysis

摘要

Transient thermoreflectance 2D thermal imaging is rapidly proving to be an effective technique for meeting the thermal analysis challenges inherent with today's advanced high speed integrated circuits. Using near infrared light illumination is particularly suitable for the thermal imaging of flip chip mounted devices and silicon substrate chips. High speed transient imaging reveals the timing of heating the spots in the circuit to identify if it is designed or unintended heating. Time-dependent unusual thermal signals provide the information of the depth location of a failure by knowing the time delay underneath the opaque layers.