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Insights into stress-induced degradation of STI-based LDMOSFETs by MR-DCIV spectroscopy

机译:MR-DCIV光谱对应力诱发的STI基LDMOSFET退化的见解

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Stress-induced degradation of STI-based LDMOSFETs has been studied by multi-region direct-current current voltage (MR-DCIV) spectroscopy, a new point of view over the traditional CP and Id-Vg characterization method. The capability of identifying the interface states in LDMOSFETs has been demonstrated by MR-DCIV spectroscopy. The correlation between device degradation and MR-DCIV spectrum has been verified by 2D device simulation. Experimental results and the degradation mechanism for both ON- and OFF-state stresses have been addressed. The role played by the interface state at channel and STI region in LDMOSFETs has been clearly revealed through MR-DCIV spectroscopy. In term of the on-resistance, the OFF-state stress leads to the worst degradation in an STI-based nLDMOS, which is attributed to the interface state generation under STI region.
机译:通过多区域直流电流电压(MR-DCIV)光谱研究了基于STI的LDMOSFET的应力引起的退化,这是对传统CP和I d -V <的新观点inf> g 表征方法。 MR-DCIV光谱技术已经证明了在LDMOSFET中识别界面状态的能力。器件退化与MR-DCIV频谱之间的相关性已通过2D器件仿真得到了验证。已经解决了导通和关断应力的实验结果和退化机理。通过MR-DCIV光谱清楚地揭示了LDMOSFET的沟道和STI区域的界面状态所起的作用。在导通电阻方面,截止状态应力导致基于STI的nLDMOS的劣化最严重,这归因于STI区域下的界面状态生成。

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