首页> 外文会议>2012 7th International Forum on Strategic Technology. >High-frequency short-pulsed metal plasma-immersion ion implantation using filtered DC vacuum-arc plasma (part two)
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High-frequency short-pulsed metal plasma-immersion ion implantation using filtered DC vacuum-arc plasma (part two)

机译:使用过滤的直流真空电弧等离子体进行高频短脉冲金属等离子体浸没离子注入(第二部分)

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摘要

An innovative concept in the development of advanced coating deposition and ion implantation method including an application of filtered DC metal plasma source and high-frequency short-pulsed negative bias voltage with a duty factor in the range 10 ÷ 99% are considered. The regularities of ion implantation and metal plasma deposition for dielectric samples are theoretically and experimentally investigated. Experimentally has been shown that metal plasma based ion implantation as well as high-concentration metal plasma ion implantation with compensation of ion surface sputtering by metal plasma deposition as well as ion-assisted coating deposition can be realized by variation of bias potential ranging from 0 V to 4 kV, pulse repetition rate smoothly adjusted in the range (2 ÷ 4.4)×105 p.p.s. and pulse duration ranging from 0.5 to 2 μs. Special features of the material treatment method depending on plasma concentration, pulse repetition rate and duty factor has been examined.
机译:考虑了先进涂层沉积和离子注入方法开发中的创新概念,包括应用滤波后的直流金属等离子体源和占空比为10÷99%的高频短脉冲负偏压。从理论上和实验上研究了电介质样品的离子注入和金属等离子体沉积规律。实验表明,通过偏置电势在0 V范围内变化,可以实现基于金属等离子体的离子注入以及通过金属等离子体沉积以及离子辅助涂层沉积补偿离子表面溅射的高浓度金属等离子体离子注入。至4 kV,脉冲重复率在(2÷4.4)×10 5 pps范围内平滑调整脉冲持续时间为0.5至2μs。已经检查了取决于血浆浓度,脉冲重复频率和占空比的材料处理方法的特殊功能。

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