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METHOD FOR DETERMINING A SHEET RESISTANCE OF A SEMICONDUCTOR SUBSTRATE AFTER PLASMA-IMMERSION ION IMPLANTATION AND THERMAL ANNEALING
METHOD FOR DETERMINING A SHEET RESISTANCE OF A SEMICONDUCTOR SUBSTRATE AFTER PLASMA-IMMERSION ION IMPLANTATION AND THERMAL ANNEALING
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机译:等离子体浸没离子注入和热退火后测定半导体基体抗剪强度的方法
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摘要
One aspect of the invention relates to a method for determining a sheet resistance of a semiconductor substrate after plasma-immersion ion implantation and thermal annealing, by means of a reflectance of the semiconductor substrate after its plasma-immersion ion implantation and before its thermal annealing, and of a lookup table indexing reflectance before thermal annealing and sheet resistance after thermal annealing.
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