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Closing Technology Knowledge Gaps Projects arising from the iNEMI Technology Roadmap

机译:iNEMI技术路线图提出的结束技术知识差距的项目

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iNEMI has been publishing its Technology Roadmap biannually for the last 14 years. The strength of these roadmaps has been the depth of the knowledge from experts worldwide combined with the breath of view taken across the whole electronic manufacturing supply chain. Every new roadmap helps identify the technology gaps in various aspects of the supply chain. These gaps then stimulate and encourage dialogue to develop consensus-based strategies resulting in industry-based joint project work or promoting research areas to the academic communities. Since 2007, there has been a focus on three main technology areas for iNEMI industry-based projects: Energy and the Environment, Miniaturization and Medical Electronics. This paper will cover the goals of these three areas and the strategies being adopted to address the present and future technology gaps, as identified in the most recent roadmaps. Results from key projects in the three areas will be presented. These will include projects on Pb-free alloy alternatives and HFR-free substrates; higher density testing and nanosolders, and Medical Components Reliability.
机译:iNEMI在过去的14年中每两年发布一次其技术路线图。这些路线图的优势在于,来自世界各地的专家对知识的深度结合了整个电子制造供应链的观点。每个新的路线图都有助于确定供应链各个方面的技术差距。然后,这些差距刺激并鼓励对话,以发展基于共识的战略,从而开展基于行业的联合项目工作或向学术界推广研究领域。自2007年以来,针对iNEMI工业项目的重点一直放在三个主要技术领域:能源与环境,小型化和医疗电子。本文将涵盖这三个领域的目标以及为解决当前和未来技术差距所采取的策略,正如最新路线图所确定的那样。将介绍这三个领域的关键项目的结果。这些将包括无铅合金替代品和无HFR基材的项目;更高密度的测试和纳米焊料,以及医疗部件的可靠性。

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