HIGH DIGITAL SPEED LEVEL-2 INTERCONNECTIONS VIA A NEW MICROCONTACT DESIGN

摘要

Requirements for high digital speed, high density, level-2 interconnections have led to development of a new microcontact. Design of this microcontact allows for separable and reusable interconnections. In this paper, we discuss methodology used to develop the microcontact, allowing 100% material utilization, present its design, including analysis and process optimization, and summarize its characteristics as they relate to electronic packaging.