A Hybrid De-Embedding Technique of Eye Diagram Measurement for High-Speed Digital Interconnections

摘要

By a modeling technique of equivalent lumped circuit for high-speed interconnections, an innovative method is proposed to predict the physical intrinsic eye diagram. Such a technique is based on the measured impedance profile results of time-domain reflectometry, which includes the electric characteristics both of the connector itself and testing jigs. The latter's are to be removed to leave the connector's part only for the eye diagram prediction. This method can be verified further by SPICE simulation and measurement in this paper.