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Quality Assessment of Advanced Photomasks Using the Q-CAP Cluster Tool

机译:使用Q-CAP群集工具进行高级光掩模的质量评估

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摘要

The reduction of wavelength in optical lithography and the use of enhancement techniques like phase shift technology, optical proximity correction (OPC), or off-axis illumination, lead to new specifications for advanced photomasks - a challenge for cost effective mask qualification. "Q-CAP", the Qualification Cluster for Advanced Photomasks, comprising different inspection tools (a photomask defect inspection station, a CD metrology system, a photomask review station and a stepper simulation software tool) was developed to face these new requirements. This paper will show the performance and reliability of quality assessment using the Q-CAP cluster tool for inspection and qualification of photomasks. Special attention is paid to a key issue of mask qualification: the impact of CD deviations, loss of pattern fidelity - especially for OPC pattern and mask defects on wafer level. Photomasks were produced containing patterns with pre-programmed defects. Wafers were processed using these testmasks. Results from inspection of these wafers are compared to predictions of different cluster tools gained during inspection of the photomasks. One aspect covered in the paper is the comparison of CD-SEM images from wafers to software stepper simulation results: aerial image and printed wafer pattern using OPTISSIMO~R Client (without and with resist model respectively). The Q-CAP cluster concept allows the combination of hardware tools as well as software tools via network communication. It is designed to be open for any tool manufacturer and mask house. All mask relevant information created during processing a photomask is stored to a SQL database and is available for all tools connected to the cluster. The cluster can be seen as one single virtual tool that facilitates full qualification of photomasks. First results using a prototype of the Q-CAP cluster in production are presented.
机译:光学平版印刷术中波长的减少以及相移技术,光学邻近校正(OPC)或离轴照明等增强技术的使用,导致了高级光掩模的新规范-挑战成本效益的掩模认证。针对这些新要求,开发了“ Q-CAP”,即高级光掩模的资格集群,它包括不同的检查工具(光掩模缺陷检查站,CD计量系统,光掩模检查站和步进仿真软件工具)。本文将展示使用Q-CAP群集工具进行光掩模检查和鉴定的质量评估的性能和可靠性。特别要注意的是掩模合格性的关键问题:CD偏差,图案保真度损失的影响-尤其对于OPC图案和晶圆水平上的掩模缺陷。产生包含具有预编程缺陷的图案的光掩模。使用这些测试掩模对晶圆进行处理。将这些晶片检查的结果与光掩模检查期间获得的不同群集工具的预测进行比较。本文涉及的一个方面是将晶片上的CD-SEM图像与软件步进仿真结果进行比较:使用OPTISSIMO〜R Client(分别不带抗蚀剂模型和带抗蚀剂模型)的航空图像和印刷的晶片图案。 Q-CAP群集概念允许通过网络通信将硬件工具和软件工具组合在一起。它被设计为可对任何工具制造商和面罩工厂开放。在处理光罩期间创建的所有与罩相关的信息都存储在SQL数据库中,并且可用于连接到群集的所有工具。该集群可以看作是一个单一的虚拟工具,可以促进对光掩模的完全鉴定。提出了使用生产中的Q-CAP群集原型的最初结果。

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