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Quality Assessment of Advanced Photomasks Using the Q-CAP Cluster Tool

机译:使用Q-CAP集群工具对高级光掩模的质量评估

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The reduction of wavelength in optical lithography and the use of enhancement techniques like phase shift technology, optical proximity correction (OPC), or off-axis illumination, lead to new specifications for advanced photomasks - a challenge for cost effective mask qualification. "Q-CAP", the Qualification Cluster for Advanced Photomasks, comprising different inspection tools (a photomask defect inspection station, a CD metrology system, a photomask review station and a stepper simulation software tool) was developed to face these new requirements. This paper will show the performance and reliability of quality assessment using the Q-CAP cluster tool for inspection and qualification of photomasks. Special attention is paid to a key issue of mask qualification: the impact of CD deviations, loss of pattern fidelity - especially for OPC pattern and mask defects on wafer level. Photomasks were produced containing patterns with pre-programmed defects. Wafers were processed using these testmasks. Results from inspection of these wafers are compared to predictions of different cluster tools gained during inspection of the photomasks. One aspect covered in the paper is the comparison of CD-SEM images from wafers to software stepper simulation results: aerial image and printed wafer pattern using OPTISSIMO~R Client (without and with resist model respectively). The Q-CAP cluster concept allows the combination of hardware tools as well as software tools via network communication. It is designed to be open for any tool manufacturer and mask house. All mask relevant information created during processing a photomask is stored to a SQL database and is available for all tools connected to the cluster. The cluster can be seen as one single virtual tool that facilitates full qualification of photomasks. First results using a prototype of the Q-CAP cluster in production are presented.
机译:波长的光学光刻和减少使用的增强技术,如相移技术,光学邻近校正(OPC),或离轴照明,导致新的规格为先进的光掩模 - 用于成本效益的掩模资格的一个挑战。 “Q-CAP”,资格集群先进光掩膜,包括不同的检查工具(光罩缺陷检测站,一个CD计量系统,光掩模检查站点和步进仿真软件工具)的开发,以面对这些新的要求。本文将展示使用检查和光掩模的资格Q-CAP集群工具质量评估的性能和可靠性。特别注意的是掩盖资格的一个关键问题:CD偏差,图案逼真的损失的影响 - 尤其是对OPC模式和屏蔽在晶片级的缺陷。光掩模制作含有具有预编程的缺陷图案。晶片使用这些testmasks处理。从这些晶片的检查结果进行比较,以的光掩模的检查期间获得的不同的群集工具的预测。覆盖在纸的一个方面是CD-SEM图像的从晶片到软件步进仿真结果的比较:使用OPTISSIMO〜 - [R客户端(不具有和具有分别抗蚀剂模型)空间图像和印刷晶片图案。所述Q-CAP群集概念允许通过网络通信的硬件工具的组合以及软件工具。它的设计是开放的任何工具制造商和面具的房子。加工光掩膜过程中产生的所有屏蔽相关信息存储到一个SQL数据库,可供连接到集群中的所有工具。群集可被视为有利于光掩模的全部限定一个单一的虚拟工具。使用原型生产中的Q-CAP簇的第一结果。

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