PACKAGING FOR PERFORMANCE LEADER MODULES AND METHODS FOR THEIR MANUFACTURING

摘要

Packaging for a power semiconductor device includes a housing, a power semiconductor module arranged within the housing, first and second liquid channels extending through the housing on opposite sides of the power semiconductor module, and first and second arrangements of heat transfer elements,each arranged within the first and second liquid channels. The first and second arrays of heat transfer elements are each physically connected to the first and second main surfaces of the power semiconductor module. Method for producing packaging for a power semiconductor device comprising: (i) connecting a first or second power semiconductor device. a second arrangement of heat transfer elements having a first or a second main surface of a power semiconductor module, (ii) encapsulating the heat transfer elements in a sacrificial material;(iii) forming a housing around the sacrificial material and heat transfer elements and (iv) removing the sacrificial material from the housing to form a first and a second liquid channel.