Performance-enhancing packaging: Designing an IGBT module packaging for high-quality and reliable operation

摘要

The role of integrated circuits (IC) packaging has expanded from that of protecting the integrity and performance of an IC, to being a central factor in the development of electronic system concepts. In fact, packaging technology is now a prime design consideration if increasingly stringent performance and reliability requirements are to be met. Thanks to a combination of tighter process tolerances, more accurate material-property measurement, and more intelligent substrate design and simulation, companies are designing more cost-effective module packages that outperform the more expensive previous-generation units.