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NOVEL PACKAGE DESIGNS TO ENABLE DUAL-SIDED COOLING ON A LASER CHIP
NOVEL PACKAGE DESIGNS TO ENABLE DUAL-SIDED COOLING ON A LASER CHIP
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机译:新颖的封装设计,可在激光芯片上实现双面冷却
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摘要
Embodiments disclosed herein include dual sided cooling architectures for laser packages. In an embodiment, an electronic package comprises a package substrate, and a laser chip attached to the package substrate. In an embodiment, the laser chip has a first surface and a second surface opposite from the first surface. In an embodiment, an interposer is disposed over the laser chip, where the interposer overhangs an edge of the laser chip. In an embodiment, the electronic package further comprises an interconnect between the interposer and the package substrate.
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