WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PROCESSING, AND METHOD FOR MANUFACTURING THIN WAFER

摘要

[Problem] To provide a wafer processing body that is resistant to a high-temperature thermal process exceeding 300° C. and can increase the productivity of a thin wafer. [Solutions] A wafer processing body in which a temporary adhesive layer is formed on a support, and a wafer having a circuit surface on the surface and a back surface to be processed is laminated on the temporary adhesive layer, wherein the temporary adhesive layer is the wafer A first temporary adhesive layer comprising a thermoplastic organopolysiloxane polymer layer (A) having a film thickness of less than 100 nm, laminated to be peelable on the surface of A second temporary adhesive layer comprising A wafer processing body provided with a composite temporary adhesive layer having a three-layer structure of a temporary adhesive layer.