Modular base with integrated heat spreader and heat sink for thermal and structural management of high performance integrated circuits and other devices

摘要

The apparatus includes a module base (400) configured to direct one or more devices (502) to be cooled.The module base includes a cover (100, 200, 300, 402) and a heat sink (404) connected to the cover.The cover includes a first sealing layer and a second sealing layer (22-104, 202-204, 302-304) and heat spreaders (106, 206, 306) in the encapsulation layer.The first sealing layer is configured to receive thermal energy from the device.The heat spreader is configured to diffuse at least a portion of the thermal energy and provide the diffused thermal energy to the second sealing layer.The heat sink is configured to receive thermal energy through the second sealing layer and transfer heat energy from the module base.The first sealing layer includes a plurality of openings (108, 208, 308).The module base includes a plurality of tabs (110, 210, 310) inserted through an opening.Each tab is configured to provide a thermal interface between at least one of the devices and the heat spreader through the first sealing layer.