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MODULE BASE WITH INTEGRATED THERMAL SPREADER AND HEAT SINK FOR THERMAL AND STRUCTURAL MANAGEMENT OF HIGH-PERFORMANCE INTEGRATED CIRCUITS OR OTHER DEVICES
MODULE BASE WITH INTEGRATED THERMAL SPREADER AND HEAT SINK FOR THERMAL AND STRUCTURAL MANAGEMENT OF HIGH-PERFORMANCE INTEGRATED CIRCUITS OR OTHER DEVICES
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机译:模块基座,具有集成的热吊具和散热器,用于高性能集成电路或其他设备的热和结构管理
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摘要
An apparatus includes a module base (400) configured to carry one or more devices (502) to be cooled. The module base includes a cover (100, 200, 300, 402) and a heat sink (404) connected to the cover. The cover includes first and second encapsulation layers (102-104, 202-204, 302-304) and a thermal spreader (106, 206, 306) between the encapsulation layers. The first encapsulation layer is configured to receive thermal energy from the device(s). The thermal spreader is configured to spread out at least some of the thermal energy and to provide the spread-out thermal energy to the second encapsulation layer. The heat sink is configured to receive the thermal energy through the second encapsulation layer and to transfer the thermal energy out of the module base. The first encapsulation layer includes multiple openings (108, 208, 308). The module base includes multiple tabs (110, 210, 310) inserted through the openings. Each tab is configured to provide a thermal interface between at least one of the device(s) and the thermal spreader through the first encapsulation layer.
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