Photosensitive resin composition, photosensitive element using the same, forming method of resist pattern, solder resist, interlayer insulating film, method of forming interlayer insulating film, manufacturing method of printed circuit board, and printed circuit board

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, a photosensitive element and a photovia material which can form an interlayer insulating film that has excellent adhesion (peel strength) to a conductor layer formed on an insulating base material and excellent insulating reliability (HAST resistance).;SOLUTION: There are provided: an alkali development type photosensitive resin composition which contains (A) a photopolymerizable compound having an ethylenically unsaturated group, (B) a photopolymerization initiator and (C) an epoxy resin, where (A) the photopolymerizable compound having the ethylenically unsaturated group contains an acid-modified epoxy (meth)acrylate compound having a carboxyl group in the molecule, and (C) the epoxy resin contains an epoxy resin compound having a thioether skeleton in the molecule; and a photosensitive element with a photosensitive layer formed using the photosensitive resin composition on a support.;SELECTED DRAWING: None;COPYRIGHT: (C)2019,JPO&INPIT