PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, SOLDER RESIST, INTERLAYER INSULATION FILM, METHOD FOR FORMING INTERLAYER INSULATION FILM, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, a photosensitive element and a photovia material which can form an interlayer insulating film that has excellent adhesion (peel strength) to a conductor layer formed on an insulating base material and excellent insulating reliability (HAST resistance).;SOLUTION: There are provided: an alkali development type photosensitive resin composition which contains (A) a photopolymerizable compound having an ethylenically unsaturated group, (B) a photopolymerization initiator and (C) an epoxy resin, where (A) the photopolymerizable compound having the ethylenically unsaturated group contains an acid-modified epoxy (meth)acrylate compound having a carboxyl group in the molecule, and (C) the epoxy resin contains an epoxy resin compound having a thioether skeleton in the molecule; and a photosensitive element with a photosensitive layer formed using the photosensitive resin composition on a support.;SELECTED DRAWING: None;COPYRIGHT: (C)2019,JPO&INPIT