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Nanoscale X-ray tomosynthesis for rapid analysis of integrated circuit (IC) dies

机译:纳米级X射线断层合成,用于快速分析集成电路(IC)模具

摘要

System and method for imaging an integrated circuit (IC). The imaging system comprises an x-ray source including a plurality of spatially and temporally addressable electron sources, an x-ray detector arranged such that incident x-rays are oriented normal to an incident surface of the x-ray detector and a three-axis stage arranged between the x-ray source and the x-ray detector, the three-axis stage configured to have mounted thereon an integrated circuit through which x-rays generated by the x-ray source pass during operation of the imaging system. The imaging system further comprises at least one controller configured to move the three-axis stage during operation of the imaging system and selectively activate a subset of the electron sources during movement of the three-axis stage to acquire a set of intensity data by the x-ray detector as the three-axis stage moves along a three-dimensional trajectory.
机译:用于成像集成电路(IC)的系统和方法。 成像系统包括包括多个空间和时间可寻址的电子源的X射线源,X射线检测器布置成使得入射X射线正常地定向到X射线检测器的入射表面和三轴 布置在X射线源和X射线检测器之间的阶段,三轴阶段被配置为安装在其上的集成电路,通过该集成电路通过该集成电路通过该成像系统的操作期间由X射线源通过该X射线。 成像系统还包括至少一个控制器,该控制器被配置为在成像系统的操作期间移动三轴级,并且在三轴级的移动期间选择性地激活电子源的子集以通过x获取一组强度数据。 -Reay检测器随着三轴级沿着三维轨迹移动。

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