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NANOSCALE X-RAY TOMOSYNTHESIS FOR RAPID ANALYSIS OF INTEGRATED CIRCUIT (IC) DIES

机译:纳米尺度X射线断层显像技术快速分析集成电路(IC)芯片

摘要

System and method for imaging an integrated circuit (IC). The imaging system comprises an x-ray source including a plurality of spatially and temporally addressable electron sources, an x-ray detector arranged such that incident x-rays are oriented normal to an incident surface of the x-ray detector and a three-axis stage arranged between the x- ray source and the x-ray detector, the three-axis stage configured to have mounted thereon an integrated circuit through which x-rays generated by the x-ray source pass during operation of the imaging system. The imaging system further comprises at least one controller configured to move the three-axis stage during operation of the imaging system and selectively activate a subset of the electron sources during movement of the three-axis stage to acquire a set of intensity data by the x-ray detector as the three-axis stage moves along a three-dimensional trajectory.
机译:用于对集成电路(IC)成像的系统和方法。该成像系统包括:x射线源,其包括多个在空间和时间上可寻址的电子源; x射线检测器,其布置成使得入射x射线垂直于x射线检测器的入射表面定向;以及三轴。在配置于X射线源与X射线检测器之间的台架上,三轴台架被配置为在其上安装有集成电路,由X射线源产生的X射线在成像系统的操作期间穿过该集成电路。所述成像系统还包括至少一个控制器,所述至少一个控制器被配置为在所述成像系统的操作期间移动所述三轴平台,并且在所述三轴平台的移动期间选择性地激活电子源的子集,以通过x获取一组强度数据。射线探测器作为三轴位移台沿着三维轨迹移动。

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