首页>
外国专利>
Electronic packaging structure and method for manufacturing the electronic packaging structure with optical guide die separate from electronic package and photonic die
Electronic packaging structure and method for manufacturing the electronic packaging structure with optical guide die separate from electronic package and photonic die
展开▼
机译:电子包装结构及其具有光学导向模具的电子包装结构与电子封装和光子模具分开的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present disclosure provides an electronic packaging structure. A photonic die is disposed on an electronic package, and an optical guide die is not disposed on the electronic package. As the optical guide die malfunctions, only the optical guide die, rather than the whole electronic package and the photonic die, which may still function well, needs to be replaced. Therefore, the replacement cost is reduced, and the lifespan of the electronic packaging structure is increased. The present disclosure also provides a method for manufacturing the electronic packaging structure.
展开▼