METHOD OF PACKAGING ELECTRONIC COMPONENT, METHOD OF MANUFACTURING MOUNTING STRUCTURE, METHOD OF MANUFACTURING ELECTRO-OPTICAL DEVICE, MOUNTING STRUCTURE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide: a method of mounting electronic components which can prevent short-circuit of terminals securely at low cost even when narrow-pitched between the terminals; a method of manufacturing a mounting structure; a method of manufacturing an electro-optical device; its mounting structure; an electro-optical device using the mounting structure; and an electronic apparatus using the electro-optical device.;SOLUTION: The structure is equipped with: a first substrate 5 provided with terminals etc. for electrode; X, Y drivers 17, 18 having a bump 23 electrically connected to the terminals etc. for electrode mounted on the first substrate; and a conductive particle 25 disposed only between the terminals etc. for electrode and the bump 23.;COPYRIGHT: (C)2007,JPO&INPIT